(Lidar関連)Trilumina Launches the World’s First Surface-mount Flip-chip Back-emitting VCSEL Array Without the Need for a Submount

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Albuquerque, N.M., June 20, 2019 – TriLumina, the leading developer of flip-chip VCSEL(vertical-cavity surface-emitting laser) technology for 3D sensing, announces the launch of the world’s first surface-mount flip-chip back-emitting VCSEL array without the need for a submount or bond wires, which allows for lower costs and higher performance than existing designs using near-infrared light-emitting laser diodes or LEDs for 3D sensing.

“We are pleased to launch this revolutionary device,” said Luke Smithwick, chief marketing officer for TriLumina. “For the first time, engineers can create extremely small, low-cost, high-performance products utilizing a NIR surface mount back-emitting VCSEL array, without the need for a large and costly submount.”

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